Wire bond through-via structure and method

ABSTRACT

A stackable integrated circuit chip layer and module device that avoids the use of electrically conductive elements on the external surfaces of a layer containing an integrated circuit die by taking advantage of conventional wire bonding equipment to provide an electrically conductive path defined by a wire bond segment that is encapsulated in a potting material so as to define an electrically conductive wire bond “through-via” accessible from at least the lower or second surface of the layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 61/403,518, filed on Sep. 17, 2010 entitled “Wire BondThrough-Via” pursuant to 35 USC 119, which application is incorporatedfully herein by reference.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH AND DEVELOPMENT

N/A

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates generally to the field of electricalinterconnection of stacked microelectronic assemblies.

More specifically, the invention relates to a stackable device thatavoids the use of electrically conductive elements on the externalsurfaces of a layer containing an integrated circuit die by takingadvantage of conventional wire bonding equipment to provide anelectrically conductive path that is encapsulated in a potting materialso as to define an electrically conductive wire bond “through-via” thatis accessible from at least the lower surface of the layer.

2. Description of the Related Art

The ability to fabricate very thin, stackable layers containing one or aplurality of homogeneous or heterogeneous integrated circuit chips isdesirable and allows high density, high speed electronic systems to beassembled for use in military, space, security and other applications.

Examples of such layers and modules are disclosed in U.S. Pat. No.6,706,971; Stackable Microcircuit Layer Formed from a PlasticEncapsulated Micro-Circuit; U.S. Pat. No. 7,768,113, Stackable TierStructure Comprising Prefabricated High Density Feedthrough, U.S. Pat.No. 7,919,844 Tier Structure With Tier Frame Having FeedthroughStructure, U.S. Pat. No. 7,174,627, Method of Fabricating Known GoodDies from Packages Integrated Circuits; U.S. Pat. No. 6,806,559, Methodand Apparatus for Connecting Vertically Stacked Integrated Circuits;U.S. Pat. No. 6,797,537, Method of Making Stackable Layers ContainingEncapsulated Integrated Circuit Chips With One or More OverlyingInterconnect Layers; U.S. Pat. No. 7,872,339, Vertically StackedPre-Packages Integrated Circuit Chips; U.S. Pat. No. 6,784,547,Stackable Layers Containing Encapsulated Integrated Circuit Chips WithOne or More Overlying Interconnect Layers; U.S. Pat. No. 6,117,704,Stackable Layer Containing Encapsulated Chips; U.S. Pat. No. 6,072,234,Stack of Equal Layer Neo-Chips Containing Encapsulated IC Chips ofDifferent Sizes, and U.S. Pat. No. 5,953,588, Stackable LayersContaining Encapsulated IC Chips.

The stacking and interconnection of very thin microelectronic layerspermits high circuit speeds in part because of short lead lengths andrelated reduced parasitic impedance and electron time-of-flight. Thesedesirable features, combined with a very high number of circuit andlayer interconnections, beneficially provide relatively large I/Odesigns to be implemented in a small volume.

The assignee of the instant application, Irvine Sensors Corporation, hasbeen a leader in developing high density packaging of IC chips,originally for use in focal plane modules, and then for use in a varietyof computer functions, such as memory. Generally, stacking of IC chipshas emphasized use of identical-area chips, each of which performs thesame function. The resulting stack is a rectangular parallelepiped (orcube) having substantially planar outer surfaces. One or more of theouter surfaces may have an access plane or side bus in electricalcommunication with the IC circuitry of the stacked chips, in order topermit connection to external circuitry.

Irvine Sensors was initially “stacking silicon” by obtainingprefabricated silicon wafers having integrated circuitry defined asindividual die thereon from a wafer manufacturer, metalizing an uppersurface of the wafer to connect each die's bond pads to an edge that islater formed when the die is diced from the wafer; dicing stackable diefrom the metalized wafer; stacking the stackable die to form die-stacks,and then forming edge connections on one or more sides of each diestack. Irvine Sensors identified certain challenges in fabricating suchdie stacks by stacking silicon die, however, for several reasons.

First, it was difficult to buy complete prefabricated wafers, for anumber of supply chain-based reasons and the fact the wafermanufacturers do not want to reveal their yield or expose their built-intest structures that could make it easier to reverse engineer theircircuitry, because the manufacturers do not usually have an existingsales structure for selling whole wafers and because the manufacturerswere concerned about liability issues if the stacked product should cometo include a defective die.

Second, it is sometimes difficult to form the edge connections on thedie stacks because they must be defined upon within the dicing streets(the inactive die surface area between the individual integrated circuitdie on the wafer) that have grown continually narrower as dicingtechnologies have improved. For example, the typical dicing street maybe 6 mils or less and the saw kerf may be about 1.5 mils with poorregistration relative to the die. As a result, a die's originalmetallization may be undesirably exposed to the edge and thereby makingit troublesome to form further access plane metallization along thatedge without shorting or damaging the die circuitry.

Third, the probability of having a defective die in any one die-stackincreases dramatically on the basis of the number of wafers in the waferstack.

As a result of the foregoing problems associated with silicon bare diestacking, Irvine Sensors developed a technology involved creating“neo-wafers” and then stacking “neo-chips” diced from the neo-wafers.

As disclosed more fully in the foregoing patents, the inventors make a“neo-wafer” by providing a bare IC die (preferably pre-tested or “knowngood” die); arranging the bare die in a spaced arrangement within awafer-shaped fixture; and then pouring a potting material such as epoxyonto the bare die within the wafer-shaped fixture. The neo-wafers, afterbeing removed from the fixture, are surface metalized and the potted dieare cut from the neo-wafers to provide “neo-chips” of equal area thatare suitable for stacking. A significant benefit of neo-wafers andneo-chips is that known good die may be used and different sized andnumber of die may be incorporated into same sized neo-chips.

None of the above prior art devices or methods provides a device thatcomprises one or more through vias that permit interconnection from theupper surface of an IC to the lower surface thereof to facilitatestacking of such die. What is needed is a device that combines the aboveattributes but that can be fabricated using well-defined processes atrelatively low cost.

BRIEF SUMMARY OF THE INVENTION

A stackable integrated circuit chip layer and module device is providedthat avoids the use of electrically conductive elements on the externalsurfaces of a layer containing an integrated circuit die by takingadvantage of conventional wire bonding equipment to provide anelectrically conductive path defined by a wire bond segment that isencapsulated in a potting material so as to define an electricallyconductive wire bond “through-via” accessible from at least the lower orsecond surface of the layer.

In a first aspect of the invention, an electronic device is providedcomprising a layer defining a first surface and a second surface, anintegrated circuit chip having an active surface with a bond pad and aninactive surface, a cross-section of an encapsulated wire bond segmentin electrical connection with the bond pad and exposed on the secondsurface of the layer.

In a second aspect of the invention, the electrical connection with thebond pad is a conductive lead assembly.

In a third aspect of the invention, the conductive lead assemblycomprises an electrically conductive trace.

In a fourth aspect of the invention, the conductive lead assemblycomprises a stud bump or equivalent conductive structure.

In a fifth aspect of the invention, a method for making an electronicdevice is disclosed comprising the steps of bonding the inactive surfaceof an integrated circuit chip having a bond pad to a metalized surfaceof a substrate, disposing a wire bond loop having a predetermined heighton the metalized surface at a predetermined location with respect to thebond pad, encapsulating a predetermined portion the wire bond loop andthe integrated circuit chip to define a first surface and a secondsurface, removing a predetermined portion of the encapsulant and thewire bond loop from the first surface to define a wire bond segmenthaving a first terminal end and a second terminal end, electricallyconnecting the bond pad to the first terminal end of the wire bondsegment using a conductive lead assembly, and, exposing the secondterminal end of the wire bond segment on the second surface.

In a sixth aspect of the invention, the conductive lead assembly of theprocess comprises a conductive trace.

In a seventh aspect of the invention, the conductive lead assembly ofthe process comprises a stud bump in electrical communication with thebond pad.

In an eighth aspect of the invention, the second terminal end of theprocess is exposed by the step of removing the substrate.

In a ninth aspect of the invention, an electronic device provided by aprocess comprising the steps of bonding the inactive surface of anintegrated circuit chip having a bond pad to a metalized surface of asubstrate, disposing a wire bond loop having a predetermined height onthe metalized surface at a predetermined location with respect to theintegrated circuit chip, encapsulating a predetermined portion the wirebond loop and the integrated circuit chip to define a first surface anda second surface, removing a predetermined portion of the encapsulantand the wire bond loop on the first surface to define a wire bondsegment having a first terminal end and a second terminal end,electrically connecting the bond pad to the first terminal end of thewire bond segment using a conductive lead assembly, and, exposing thesecond terminal end of the wire bond segment on the second surface.

In a tenth aspect of the invention, the conductive lead assembly of thedevice of the process comprises a conductive trace.

In an eleventh aspect of the invention, the conductive lead assembly ofthe device of the process comprises a stud bump in electricalcommunication with the bond pad.

In a twelfth aspect of the invention, the second terminal end of thedevice of the process is exposed by the step of removing the substrate.

In a thirteenth aspect of the invention, an electronic module or devicecomprising a plurality of stacked layers is provided wherein a firstlayer and a second layer each comprise a first surface and a secondsurface, an integrated circuit chip having an active surface with a bondpad and an inactive surface, a cross-section of an encapsulated wirebond segment in electrical connection with the bond pad and exposed onthe second surface of the layer and wherein the first layer is inelectrical communication with the second layer such as by electricalconnection between the first surface of a first layer and the secondsurface of the second layer.

These and various additional aspects, embodiments and advantages of thepresent invention will become immediately apparent to those of ordinaryskill in the art upon review of the Detailed Description and any claimsto follow.

While the claimed apparatus and method herein has or will be describedfor the sake of grammatical fluidity with functional explanations, it isto be understood that the claims, unless expressly formulated under 35USC 112, are not to be construed as necessarily limited in any way bythe construction of “means” or “steps” limitations, but are to beaccorded the full scope of the meaning and equivalents of the definitionprovided by the claims under the judicial doctrine of equivalents, andin the case where the claims are expressly formulated under 35 USC 112,are to be accorded full statutory equivalents under 35 USC 112.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 shows a metalized layer on the substrate.

FIG. 2 shows an integrated circuit chip attached by a film adhesive tothe substrate.

FIG. 3 shows gold stud bumps applied to bond pads on the active surfaceof the integrated circuit die of FIG. 2.

FIG. 4 shows a wire bond loop, a portion of which will function as awire bond via, applied to the metalized surface of the substrate.

FIG. 5 shows the integrated circuit die encapsulated in a pottingcompound.

FIG. 6 shows the assembly where a predetermined portion of first surfaceof the assembly has been removed to expose a portion of the one or moregold stud bumps.

FIG. 7 shows re-route traces applied to the assembly to define aconductive lead assembly from the exposed surface of the stud bump tothe exposed cross-section of the encapsulated wire bond segment.

FIG. 8 shows a dielectric layer applied over the conductive leadassembly and first surface.

FIG. 9 shows the substrate and metalized layer removed from theassembly.

FIG. 10 shows a contact pad and solder ball on the second surface of theassembly.

FIG. 11 shows a preferred embodiment of the device of the inventionafter dicing to final dimensions.

FIG. 11A shows a stack of the layers of the invention bonded and inelectrical communication with each other to define a three dimensionalmicro-electronic module.

FIG. 12 illustrates a set of process steps in a preferred process of theinvention.

The invention and its various embodiments can now be better understoodby turning to the following detailed description of the preferredembodiments which are presented as illustrated examples of the inventiondefined in the claims. It is expressly understood that the invention asdefined by the claims may be broader than the illustrated embodimentsdescribed below.

DETAILED DESCRIPTION OF THE INVENTION

The device and method of the invention beneficially avoid the need forconductive elements disposed on the external surfaces of devices orassemblies and which can be damaged or tampered with, by incorporatingvertical, conductive wire bond segments within a potting compound orencapsulant which is especially useful on tamper-resistant devices andassemblies. Such a configuration further enables such concealed verticalinterconnections to be used with a single die of any size and/or onmultiple die assemblies, each of the same or different size.

The method of the invention may be used to stack memory or processor dieon top of each other with a simple BGA interconnect or any type of diemay be used preferably in applications were the common footprint isestablished from the largest sized die in the stack.

The following process steps generally describe a preferred embodiment ofthe invention and a preferred set of process steps for making same.

Turning now to the figures wherein like numerals define like elementsamong the several views, a stackable integrated circuit chip layer andmodule device that uses a wire bond segment to provide a “through-via”accessible from at least the lower or second surface of the layer isdisclosed.

As seen in FIG. 1, a suitable sacrificial substrate 1 is provided whichmay be comprised of, for instance, an FR-4 PWB material, siliconmaterial, aluminum material or equivalent substrate material whoseproperties are preferably compatible with the potting encapsulantmaterial to be used; and that can be metalized by suitable means and canbe processed by photolithography is selected. The sacrificial substrate1 dimensions are preferably selected to accommodate the tail ends ofwire bond loops.

At least one surface of the selected substrate 1 is then metalized suchas by vacuum deposition, plating, or other means preferably using a wirebondable metal to define a metalized layer 5. The deposited metal layer5 is preferably thick enough to allow wire bonding.

As seen in FIG. 2, the inactive surface 10 of integrated circuit chip 15to be processed is bonded to the substrate 1 with active surface 20comprising one or more contact bond pads 25 to be interconnected facingup at a predetermined location which locations may be determined by thegeometry of the required interconnections. The adhesive material 30 usedto bond the integrated circuit chip 15 to metalized layer 5 may be anepoxy that is compatible with the potting compound and the substratematerial.

As seen in FIG. 3, after integrated circuit chip 15 is bonded tosubstrate 1, separately provided stud bumps or equivalent conductivestructures 35 may be applied to bond pads 25 which stud bumps 35 mayexposed in subsequent processing steps as is further discussed below.

Turning to FIG. 4, a separately provided wire bond loop 40 is disposedat one or more predetermined locations on metalized layer 5 with respectto the bond pad locations on integrated circuit chip 15.

Conventional wire bonding equipment may be programmed to index thebonding sequence off a selected bond pad 25 location on the integratedcircuit chip 15 under process.

Metalized layer 5 on the substrate 1 is wire bonded to define a wirebond loop 40 having a predetermined height 45. The wire bonder may beprogrammed to maximize the vertical distance it travels, and itsverticality, before the bond bends over and down to terminate thebonding operation further out and away from integrated circuit chip 15on the substrate 1.

In a preferred embodiment, a conductive metal wire bond loop and segmentcomprises a wire material such as a gold, copper and aluminum materialof diameter on the order of about 0.002″ or larger diameter used with bywire bonding equipment, which wire material desirably has a much largercurrent carrying capacity than, for example, vacuum deposited metalsused for similar interconnection purposes.

As seen in FIG. 5, the assembly is encapsulated or “potted” in anencapsulant 50, using a suitable potting compound such as Hysol FP4562,by embedding the assembly in the potting material preferably until itencapsulates all or at least a portion of stud bumps 35, integratedcircuit chip 15 and wire bond loop 40 up a predetermined height whichmay comprise the entirety of wire bond loop 40. The predetermined heightmay be up to at least the bending position of the highest of the wirebond loops on the assembly.

Once the encapsulant is cured, the assembly defines a first surface 55and a second surface 60.

As depicted in FIG. 6, a predetermined portion of first surface 55 ofthe potted structure (i.e. the surface opposing substrate 1) is removedsuch as by grinding or lapping until a predetermined portion of studbumps 35 on integrated circuit chip 15 are exposed without exposing theactive surface 20 of integrated circuit chip 15 itself which woulddamage the integrated circuitry thereon. Concurrently, the removal of apredetermined portion of first surface 55 removes a portion or wire bondloop 40 to define wire bond segment 65.

Wire bond segment 65 defines an exposed cross-section as a firstterminal end 70 and a second terminal end 75 (which may be the wire ballbond of the wire bond loop). The wire cross-section as terminal end 70is exposed in a separately-provided grinding process step of the removalof a predetermined portion of the first surface 55 of the assembly.

In an alternative embodiment of the device and process of the invention,the wire bond loop fabrication step may be eliminated and the wire bondsegment 65 instead may comprise a stack of wire bond machine “studbumps”, which may be “coined” as is known in the wire bonding arts. Thestack of stud bumps have the equivalent function and acts as wire bondsegment 65 and which may be applied in electrical communication withsubstrate 1. The stack of stud bumps in this alternative embodiment maybe applied at predetermined locations on substrate 1 using aconventional wire bonding machine such as is available from West Bond,Inc. If stud bumps are used in lieu of a wire bond loop, the wire bondequipment is preferably capable of generating a relatively uniform studbump height.

The alternative stud bump embodiment of the wire bond segment 65structure of the invention comprises multiple, stacked stud bumps thatare formed by the use of wire bonding equipment. As is known in the wirebond arts, columns of wire balls, or stud bumps may be fabricated on thesubstrate 1 at a predetermined pitch, encapsulated in the dielectricencapsulant material and then the substrate and a predetermined portionof the encapsulant removed as by grinding, lapping, or back-thinning.The terminal surfaces of the stud bump stack through-via structure areground as part of the grinding process to expose the stud bump stackterminal ends 55 and 60 in the columns. The resultant structure thencomprises an array of encapsulated conductive columns suitable for usein the instant invention.

The average height of a stud bump formed with 2-mil Au wire is about 80um in height. Since a two-mil wire is usually the maximum size that wirebonders can run, the stud bumping operation should be monitored toobserve the overall stud bump height tolerances which may quickly changefrom stack to stack due to compression forces and stack tilt.

A thin residual layer 80 of the dielectric potting epoxy will remaindisposed on active surface 20.

As illustrated in FIG. 7, desired electrical interconnections in theform of metalized conductive lead assemblies 85 are fabricated usingwell-understood photolithographic and plating process or by equivalentprocess means, to delineate conductive trace routings from the exposedstud bump 35 and exposed first terminal end 70.

Note the grinding or lapping operation may be used both to bring theassembly to a predetermined thickness and at the same time to exposecross-section of the wire bond loops applied by wire bonding.

FIG. 8 shows a dielectric layer or coating 90 is disposed on firstsurface 55. In a preferred embodiment, one or more apertures or vias 92may be defined in the dielectric layer 90 to expose a portion of one ormore the electrically conductive lead assemblies 85 and to permit thereceiving of and electrical connection with external circuitry such as,one or more solder balls on the second surface of a layer of theinvention in a stacked plurality of layers of the invention asillustrated in FIG. 11A.

As seen in FIG. 9, a predetermined portion of second surface 60 whichmay include substrate 1 and metalized layer 5 is removed such as bylapping or grinding until second terminal end 75 is exposed or until apredetermined die thickness is obtained, or both or at which pointsubstrate 1 and metalized layer 5 have been completely or almostcompletely removed.

As illustrated in FIG. 10, once the second surface of the assembly hasbeen lapped to the final thickness, bond pads or solder balls 95 may beapplied to the second surface of the assembly to complete thethrough-via structure.

As seen in FIG. 11, the assembly may be diced to final size eliminatingthe remaining wire bond portions or tails, resulting in an integratedcircuit chip layer suitable for stacking in a multilayer microelectronicmodule using one or more wire vertical thru-via structures.

As best seen in FIG. 11A, in the preferred embodiment of the device, anaperture or via 92 is provided in dielectric layer 90 to expose at leasta portion of electrically conductive structure 85 for electricalconnection to another circuit, such as, for instance, a second layer ofthe invention in a stacked configuration. The electrical connectionbetween the layers may be achieved by, for instance, a solder ball,solder paste, Z-conductive epoxy or equivalent electrical connectionmeans.

In a preferred embodiment, the integrated circuit die thickness is fromabout 10 mils to about 32 mils in thickness, the wire bond look heightis about 2 mm and the substrate thickness from about 60 mils to about 90mils.

In a preferred embodiment, a plurality of rows of vertical wire bondloops are disposed around the perimeter of the die with a inside rowhaving a distance of about 5 mm from ball to wedge and the outside rowhaving a distance of about 3 mm from ball to wedge.

In a preferred embodiment of the final device of the invention, thefirst row of vertical wire bond segments may be about 0.35 mm from thevertical edge of the die and having a pitch of about 0.35 mm. The finaldiced size is preferably about 1 mm beyond the outermost row of verticalwire bond segments.

Finally, as seen in FIG. 12, a set of process steps is shown thatillustrate a preferred process of the invention.

Many alterations and modifications may be made by those having ordinaryskill in the art without departing from the spirit and scope of theinvention. Therefore, it must be understood that the illustratedembodiment has been set forth only for the purposes of example and thatit should not be taken as limiting the invention as defined by thefollowing claims. For example, notwithstanding the fact that theelements of a claim are set forth below in a certain combination, itmust be expressly understood that the invention includes othercombinations of fewer, more or different elements, which are disclosedabove even when not initially claimed in such combinations.

The words used in this specification to describe the invention and itsvarious embodiments are to be understood not only in the sense of theircommonly defined meanings, but to include by special definition in thisspecification structure, material or acts beyond the scope of thecommonly defined meanings. Thus if an element can be understood in thecontext of this specification as including more than one meaning, thenits use in a claim must be understood as being generic to all possiblemeanings supported by the specification and by the word itself.

The definitions of the words or elements of the following claims are,therefore, defined in this specification to include not only thecombination of elements which are literally set forth, but allequivalent structure, material or acts for performing substantially thesame function in substantially the same way to obtain substantially thesame result. In this sense it is therefore contemplated that anequivalent substitution of two or more elements may be made for any oneof the elements in the claims below or that a single element may besubstituted for two or more elements in a claim. Although elements maybe described above as acting in certain combinations and even initiallyclaimed as such, it is to be expressly understood that one or moreelements from a claimed combination can in some cases be excised fromthe combination and that the claimed combination may be directed to asubcombination or variation of a subcombination.

Insubstantial changes from the claimed subject matter as viewed by aperson with ordinary skill in the art, now known or later devised, areexpressly contemplated as being equivalently within the scope of theclaims. Therefore, obvious substitutions now or later known to one withordinary skill in the art are defined to be within the scope of thedefined elements.

The claims are thus to be understood to include what is specificallyillustrated and described above, what is conceptually equivalent, whatcan be obviously substituted and also what essentially incorporates theessential idea of the invention.

We claim:
 1. An electronic device comprising: a layer comprising a firstsurface and a second surface, an integrated circuit chip having anactive surface with a bond pad and an inactive surface, and, across-section of an encapsulated wire bond segment in electricalconnection with the bond pad and exposed on the second surface of thelayer.
 2. The device of claim 1, wherein the electrical connection withthe bond pad is a conductive lead assembly.
 3. The device of claim 2,wherein the conductive lead assembly comprises an electricallyconductive trace.
 4. The device of claim 2, wherein the conductive leadassembly comprises a stud bump in electrical communication with the bondpad.
 5. A method for making an electronic device comprising a set ofsteps of: bonding an inactive surface of an integrated circuit chiphaving a bond pad to a metalized surface of a substrate, disposing awire bond loop having a predetermined height on the metalized surface ata predetermined location with respect to the bond pad, encapsulating apredetermined portion of the wire bond loop and the integrated circuitchip with an encapsulant to define a first surface and a second surface,removing a predetermined portion of the encapsulant and the wire bondloop from the first surface to define a wire bond segment having a firstterminal end and a second terminal end, electrically connecting the bondpad to the first terminal end of the wire bond segment using aconductive lead assembly, and, exposing the second terminal end of thewire bond segment on the second surface.
 6. The process of claim 5,wherein the electronic device comprises a conductive trace.
 7. Theprocess of claim 5, wherein in the electronic device comprises a studbump in electrical communication with the bond pad.
 8. The process ofclaim 5, wherein the second terminal end is exposed by removing thesubstrate.
 9. An electronic device provided by a process comprising aset of steps of: bonding an inactive surface of an integrated circuitchip having a bond pad to a metalized surface of a substrate, disposinga wire bond loop having a predetermined height on the metalized surfaceat a predetermined location with respect to the integrated circuit chip,encapsulating a predetermined portion of the wire bond loop and theintegrated circuit chip with an encapsulant to define a first surfaceand a second surface, removing a predetermined portion of theencapsulant and the wire bond loop on the first surface to define a wirebond segment having a first terminal end and a second terminal end,electrically connecting the bond pad to the first terminal end of thewire bond segment using a conductive lead assembly, and, exposing thesecond terminal end of the wire bond segment on the second surface. 10.The device of claim 9, wherein the electronic device comprises aconductive trace.
 11. The device of claim 9, wherein the electronicdevice comprises a stud bump in electrical communication with the bondpad.
 12. The device of claim 9, wherein the second terminal end isexposed by removing the substrate.